Taipei, Taiwan－April 14^th, 2016－Thermaltake has presented the latest TT Premium product line – the new Core W Series: Core W200 and Core WP200 super tower chassis with the Core P200 pedestal chassis – following after the Core W Series (WP100/W100), designed with the TT Premium core values of Excellent Quality, Unique Design, Diverse Combinations and Boundless Creativity to deliver versatility in different superior looks. Being the first dual system chassis with full assembly concept, the Core W Series is a great opportunity for makers to start from zero and experience true “DIY” by putting every piece together to complete a high-end system. The Core WP200/W200 is capable of housing more than twenty drive trays and up to ten expansion slots, which can be served as another workstation in the industrial field. With its unprecedented space for high-end hardware and liquid cooling expansion, the Core WP200/W200 supports the latest XL-ATX, E-ATX, ATX, Micro ATX, Mini-ITX motherboards, and also SSI MEB. All standard equipment for the chassis is included. Makers only need to purchase the custom liquid cooling components and incorporate externally-modular upgrades to build an aesthetically-superior water cooling chassis.

TT Premium
To continue achieving the corporate mission of delivering the perfect user experience, Thermaltake developed “TT Premium” with the essence of combining supreme quality products with a new logo design. TT Premium is far more than just a guarantee of quality. Behind the name, it represents the passion in DIY, Modding and Thermaltake’s desire to be the most innovative brand in the PC hardware market. To satisfy the demand of the high-end PC users, TT Premium follows its core values of Excellent Quality, Unique Design, Diverse Combinations and Boundless Creativity to provide a high performance PC product for every enthusiast.

Exclusively “Tt LCS Certified”
Tt LCS Certified is a Thermaltake exclusive certification applied to products that pass the design and rigorous hardcore enthusiast standards that only the world’s best LCS chassis are held to. The Tt LCS certification was created so that we at Thermaltake can clearly convey to power users and enthusiasts which chassis are built and tested to be best compatible under extreme liquid cooling configurations. This ensures you get the best performance, compatibility and features.

Details about Core W200:

DMD – Dismantlable Modular Design
With removable “3 + 14” drive racks and freely interchangeable SSD/HDD cage sections, the Core W200 offers more for maximum interior space. Take the advantage to include high-end, maximum capacity, cooling allotment without the reduction of GPU length limitations when incorporating liquid cooling expansion for the ultimate cooling performance.

Workstation Concept
With more than 20 drive trays and 10 PCIe slots, the Core W200 can be used as another workstation for technical or scientific purposes, holding data or hosting a number of different features between computers. Compatible with the latest Intel processors and AMD/NVIDIA graphics cards, the Core WP200 delivers exceptional performance and creates an effective work environment.

Dual System in One
Due to the partition of the chassis, users are capable of putting two systems in the case. The Core W200 has room for XL-ATX, E-ATX, ATX, Micro ATX, and Mini-ITX builds. With two systems in one case, there are also two sets of I/O buttons located on the top front of the case.

Superior Expansion
Designed for high-end gaming system and workstation compatibility, the Core W200’s modular drive racks allow makers to easily install up to more than twenty data storage devices, a dual slot VGA of up to 635mm in length, and a tower CPU cooler as high as 200mm. Even with a high-wattage PSU stretching to 220mm in length, there is still plenty of space for cable management. Moreover, a 360mm radiator can be installed in the front of the chassis, delivering superior cooling performance.

Outstanding Ventilation
The Core W200’s unparalleled cooling ability offers fan brackets with various mounting points to support any type of gaming system that can be accommodated, including DIY/AIO liquid-cooling systems and air-cooling units. Fans can be mounted anywhere inside the chassis: supports up to three 140mm fans at the front and a rear 140mm fan guarantees the flow of aeration; three large 200mm fans on the top panel as well as three 140mm fans at the bottom, while there are still rooms for 120mm, 140mm, and 200mm fans on both sides.

Versatile Expandability
With its stacking design, the Core W200 and the Core P200 create two different combinations: by stacking the Core P200 on the top or at the bottom of the Core W200. The mix and match of Core WP200 offers an expandable system allowing enthusiasts to incorporate externally-modular upgrades. Stacked together, the chassis opens up space to expand the liquid cooling system, the storage solutions, and can even create dual systems, thereby enabling a dedicated top/bottom set-up for pure cooling. When stacked, the maximum radiator length supported is 600mm on the front side.

Expand the limits with the stackable Core P200 Pedestal (sold separately) allowing externally-modular upgrades for even more cooling and power capabilities.

Details about Core WP200:

DMD – Dismantlable Modular Design
With removable “3 + 14” drive racks and freely interchangeable SSD/HDD cage sections, the Core WP200 offers more for maximum interior space. Take the advantage to include high-end, maximum capacity, cooling allotment without the reduction of GPU length limitations when incorporating liquid cooling expansion for the ultimate cooling performance.

Workstation Concept
Capable of housing more than 20 HDD drive trays and 10 PCIe slots, the Core WP200 can be used as another workstation for technical or scientific purposes, holding data or hosting a number of different features between computers. Compatible with the latest Intel processors and AMD/NVIDIA graphics cards, the Core WP200 delivers exceptional performance and creates an effective work environment.

Dual System in One
Due to the partition of the chassis, users are capable of putting two systems in the case. The Core WP200 has room for XL-ATX, E-ATX, ATX, Micro ATX, and Mini-ITX builds. With two systems in one case, there are also two sets of I/O buttons located on the top front of the case.

Superior Expansion
Designed for high-end gaming systems and workstation compatibility, the Core WP200’s modular drive racks allow makers to easily install up to more than twenty data storage devices, a dual slot VGA of up to 635mm in length, and a tower CPU cooler as high as 200mm. Even with a high-wattage PSU stretching to 220mm in length, there is still plenty of space for cable management. Moreover, a 360mm radiator can be installed in the front of the chassis, delivering superior cooling performance.

Outstanding Ventilation
The Core WP200’s unparalleled cooling ability offers fan brackets with various mounting points to support any type of cooling you can dream of including DIY/AIO liquid-cooling systems and air-cooling units. Fans can be mounted anywhere inside the chassis: support for up to eight 140mm fans at the front and a rear 140mm fan guarantees excellent airflow capabilities; three large 200mm fans on the top panel as well as six 140mm fans at the bottom, while there is still room for 120mm, 140mm, and 200mm fans on both sides.

Versatile Expandability
With its stacking design, the Core W200 and the Core P200 create two different combinations: by stacking the Core P200 on the top or at the bottom of the Core W200. The mix and match of Core WP200 offers an expandable system allowing enthusiasts to incorporate externally-modular upgrades. Stacked together, the chassis opens up space to expand the liquid cooling system, the storage solutions, and can even create dual systems, thereby enabling a dedicated top/bottom set-up for pure cooling. When stacked, the maximum radiator length supported is 600mm on the front side.

Expand your maker limits with the stackable Core P200 Pedestal (sold separately) for externally-modular upgrades, and boost your cooling and power capabilities.

TAIPEI, Taiwan, April 13, 2016 – Not in the wake of Poseidon, but the intense quests of DDR4 memory overclocking, G.SKILL has released its Trident Z DDR4 4333MHz memory modules. Apparently, these overpowered memory sticks named after the destructive weapon of Neptune are meant to operate at a brain melting 4333MHz frequency, however they are not destined to be wielded by just any mortal, currently only ASRock’s overclocking oriented motherboard – Z170M OC Formula has what it takes to support these legendary memory DIMMs.

Frank, marketing manager from G.SKILL further illustrated, “G.SKILL Trident Z DDR4 4333MHz memory kit is specifically designed for extreme overclocking on the latest ASRock Z170M OC Formula motherboard and 6^th Gen Intel^® Core Processors. Using only specially selected performance components, it is the speediest DDR4 memory kit on the market today that pushes the Z170 platform to its extreme limits.”

ASRock Z170M OC Formula might be an mATX sized Skylake motherboard, yet the compact PCB layout possesses a lot more computing power than your average build. Designed by the enigmatic overclocker Nick Shih, it features a server grade ten layer PCB design that results in interference-less signals, which is especially beneficial for memory signals. Overclockers who are dead serious about breaking limits may find ASRock Z170M OC Formula on Newegg.

For more information about ASRock Z170M OC Formula:
http://www.asrock.com.tw/mb/Intel/Z170M%20OC%20Formula/

TAIPEI, Taiwan, April 12, 2016 – Whether you were aware of it before or not, Intel’s new line of 14 nanometer die shrink Intel^® next gen socket 2011-3 processors are arriving shortly this year, and ASRock’s engineers have already completed uploading new versions of BIOS for their X99 motherboards to support these Intel^® next gen socket 2011-3 CPUs. Clearly the new chips aren’t available in the market yet, but if patience isn’t your strong suit, then perhaps you could get a two minute head start by downloading the BIOS and upgrading now.

The most unmissable part of Intel^® next gen socket 2011-3 CPU is the flagship, which will be the first deca-core processor for the commercial market. While this new CPU boasts a compelling ten cores and twenty threads architecture, users require a BIOS update for their motherboards to handle it, this update applies to the rest of the Intel^® next gen socket 2011-3 CPU gang as well. Rest assured that ASRock’s former X99 chipset motherboards will all support the new chips. Upgrade now and hold on to your horses until the new CPUs are delivered, just don’t hold your breath.

Memberikan ketersediaan lebih awal dari jadwal sebelumnya,  prosesor generasi terbaru diciptakan untuk melipatgandakan persentasi performa dalam komputasi dan grafis bagi para desainer dari seluruh OEM PC global¹

SUNNYVALE, CA — 6 April 2016 — AMD (NASDAQ: AMD) hari ini mengumumkan ketersediaan lebih awal dari prosesor mobile AMD APU A-Series generasi ke-7, yang diatur untuk mendukung notebook terbaru yang didesain oleh HP Inc. Notebook ini dilengkapi dengan video canggih, grafis, performa dan fitur-fitur keamanan yang didesain untuk mendorong produktivitas dan memperbanyak merasakan hiburan, prosesor-prosesor AMD APU A-Series generasi ke-7 (bernama kode Bristol Ridge) ini juga menyediakan efisien energi yang luar biasa.

Desain PC OEM baru ini ditenagai oleh prosesor-prosesor mobile AMD APU A-Series generasi ke-7-mulai dari notebook ultrathin, convertible notebook hingga All-in-Ones (AIO)- yang akan dipasarkan pertama kali adalah HP ENVY x360 dan OEM lainnya yang diharapkan akan diumumkan tahun ini. AMD akan secara resmi memperkenalkan AMD APU A-Series  generasi ke-7 dan memamerkan beragam desain OEM pada acara Computex 2016 tanggal 31 Mei hingga 4 Juni di Taipei Taiwan.

“Kami tahu bahwa dengan uang yang sudah mereka keluarkan, konsumer ingin mendapatkan performa yang lebih yaitu dengan grafis yang lebih tajam, performa yang lebih cepat dan baterai yang lebih tahan lama. Kami selama ini fokus bekerja dengan rekan-rekan OEM untuk membangun platform komputasi yang luar biasa bagus yang akan sepenuhnya memanfaatkan kemampuan AMD APU A-Series generasi ke-7,” kata Jim Anderson, senior vice president and general manager, Computing and Graphics Business Group, AMD. “Saya sangat senang bahwa konsumer akan mulai melihat beberapa sistem luar biasa yang akan segera memasuki pasar. Saya sangat bangga atas kemampuan luar biasa para ahli di AMD dalam mengerjakannya sehingga memampukan kita untuk mempercepat produk-produk baru ini masuk pasar untuk para konsumer dan pengguna kami.”

“Ini merupakan hal menyenangkan bagi  HP menjadi yang pertama membawa teknologi AMD APU A-Series generasi ke-7 ke pasar, khususnya dalam mendesain notebook baru,” kata Kevin Frost, vice president and general manager, Consumer Personal Systems, HP Inc. “Kami kira HP ENVY x360 akan menjadi bagian penting bersama para konsumer yang mencari hiburan dan produktifitas serta kemampuan yang baik dari x360  yang benar-benar menampilkan keahlian grafis dan komputasi AMD.”

“Sekarang, quad dan dual core prosesor dari AMD A-Series generasi ke-7 sedang dikirimkan untuk para mitra OEM kami, produk ini menampilkan desain prosesor Excavator x86 yang dioptimalkan pada perangkat mobile untuk kecepatan tinggi dalam komputasi, dan Radeon R7 atau grafis R5 untuk bermain games online dan menambah kemampuan streaming HD”. Saat dibandingkan dengan Kaveri berdasarkan prosesor AMD FX pada kekuatan yang sama, prosesor-prosesor FX generasi ke-7 memberikan performa lebih dari 40%  single-threaded CPU¹.

AMD APU A-Series generasi ke-7 akan memungkinkan pengguna untuk menikmati multimedia terkini, merasakan video dalam resolusi Ultra HD 4K dan dukungan teknologi AMD FreeSync untuk gambar yang tanpa patah-patah, artefak – performa game online  dalam notebook yang mumpuni dan konfigurasi AIO.

Untuk informasi terkini  AMD APU A-Series generasi ke-7, kunjungi www.amd.com/APU. Pelajari lebih lanjut tentang bagaimana komputasi AMD dan grafisnya memperkuat produk-produk yang Anda sukai, kunjungi www.amd.com/innovation.

Sumber-sumber Pendukung

• Pelajari lebih lanjut tentang APU AMD A-Series generasi ke-7.
• Pelajari lebih lanjut tentang HP ENVY x360
• Menjadi fan AMD di Facebook
• Follow akun @AMD di Twitter

Catatan Kaki :

1. Pengujian oleh laboratorium AMD Perfomance, produsen PC mungkin beragam konfigurasi memberikan hasil yang berbeda. 3DMark 11 Performance digunakan untuk mensimulasikan kinerja gaming; AMD FX ™ generasi ke-7 @ 15W mencetak 2.409 sedangkan AMD FX-8800P generasi ke-6 @ 15W mencetak 1956, untuk perbedaan skor benchmark 2409/1956 = 1.23X atau 23%. Konfigurasi sistem: 7 Generation FX ™ @ 15W: AMD “Gardenia” platform, 2×4096 DDR4-1866 RAM, 244GB SSD drive (Non-rotating), Microsoft Windows 10 Enterprise, Graphics driver 15.300.0.0 2015-11-09FX-8800P: AMD FX-8800P dengan AMD Radeon R7 Graphics, 2×4096 DDR3-1600 RAM, 244GB SSD drive (Non-rotating), Microsoft Windows 10 Enterprise, Graphics driver 15.300.1025.0 2015/11/13 BRN-7.
2. Pengujian oleh laboratorium AMD Performance. Produsen PC mungkin memberikan beragam konfigurasi hasil yang berbeda. Cinebench R15 1T digunakan untuk mewakili per kinerja inti; AMD generasi ke-7 2016 FX @ 35W mencetak 93,24 sedangkan AMD FX 2014 @ 35W mencetak 66,48, untuk perbedaan skor benchmark 93,24 / 66,48 = 1.40X atau 40%.  AMD FX generasi ke-6 @ 35W mencetak 81.82BRN-17.

COMPUTEX Taipei 2016 opens from May 31^st to June 4^th. Organized by the Ministry of Economic Affairs (MOEA) and executed by Taiwan External Trade Development Council (TAITRA), CPX Conference is set to be the best platform for international technology companies to share innovative industry trends and the latest observations. TAITRA, as one of the organizers of CPX Conference, sets the theme “Internet of Things (IoT), Smart Innovations” and announces the 2016 speakers list today, which among them are senior representatives from the Swiss robot maker, ABB, ARM, Bosch Sensortec, Cisco, Ericsson, Siemens, SoftBank Korea and other industry leaders who will be speaking the vision of IoT applications and the future of smart technology.

President-elect Tsai Ing-wen stated that Taiwan, with profound IoT development potential, may play a key role to lead the industry innovation. And for such, an “IoT volunteers group” was formed for the purpose to united local and global companies to foster business opportunities. To align itself with the government and future industry development, 2016 CPX Conference will present with all-new standard of keynote speeches and forums on ICT industry and extending the importance of IoT by international experts.

This year’s CPX Conference’s keynotes center on two major topics – Future Technology and Smart Manufacturing. Simon Segars, CEO of ARM, a world leading mobile processors supplier, is invited to kick start the keynotes by sharing analyses on future trends in the latest technology. Erdal Elver, CEO & President of Siemens, returns to COMPUTEX after 3 years, will speak of Industry 4.0 and make a wave in the smart manufacturing. In addition, with the upswing of global smart startup industry, three top innovators will be addressing at the keynotes. Vito Di Bari, the futurist and innovation designer of Milan Candidate City Expo 2015, a first-timer at COMPUTEX, Steve Wyatt, Group Vice President of ABB Robotics, and Lucas Wang, Founder and CEO of HWTrek, a platform for connecting hardware entrepreneurs around the world.

Topics at the CPX Conference forum will be on IoT Ecosystem Partnerships and IoT Applications. IoT Ecosystem Partnerships will be presented jointly by Ericsson and Cisco, which are long-term COMPUTEX partners, and the first time participant, SoftBank Korea. They will be addressing solutions to network and wireless communications in the modern IoT era. On the other hand, Bosch SensorTech and the UK startup BLOCKS Wearables will be speaking the topic of IoT Applications. They will share their observations on how to build a life with future technology in security monitoring, smart home and entertainment, telematics, automotive electronics, wearable devices, as well as smart technology solutions.

Mr. Walter Yeh, Executive Vice President of TAITRA, said, “2016 CPX Conference is built as a knowledge exchange platform. With new aspects in keynotes and theme forums, we look forward to the trending topics and analyses brought by each of the visionary industry leader.” Since the announcement of successful recruitment for COMPUTEX 2016, the exhibition continues to receive supports from C-level executives in the IT sector. Taiwan with its solid base in technology industry is expected to be the leading smart technology platform for the IoT market. For more updated information regarding the new CPX Conference and keynote speakers at 2016 COMPUTEX, please refer to the official COMPUTEX website athttps://www.ComputexTaipei.com.tw/